Meet TESCAN at
Microscopy Conference 2025
Join TESCAN for Live Demos, Expert Sessions,
and Innovation at MC 2025
Booth #15 · Live Demos · Scientific Sessions · New Features
Aug 31 – Sept 4 · Messe Karlsruhe · Germany
TESCAN is heading back to MC - as always, ready to connect, share, and inspire.
Visit us at Booth #15 for live demonstrations of our most advanced platforms for electron microscopy, micro-CT, and nanoscale analysis. Whether you're working in R&D, failure analysis, quality control, or academic research, you'll see how TESCAN supports your work through intelligent automation, multimodal characterisation, and user-centered innovation.
Something new is coming to MC - and it starts at TESCAN’s booth.
Stop by, and you’ll see it in a whole new way.
Book a Live Demo
Meet our experts throughout the day and book a personalized, on-screen walkthrough of the latest innovations and workflows we’re showcasing at the event.

MIRA XR
Ultra-High-Resolution SEM for Fast Materials Analysis
Designed for high-throughput labs, MIRA XR delivers reliable nanoscale imaging with intuitive controls and seamless EDS mapping — ideal for both expert users and shared facilities
MIRA XR

AMBER X 2
High-Throughput Plasma FIB-SEM for Advanced Applications
3D analysis, TEM prep and delayering — all in one platform. AMBER X 2 combines field-free UHR-SEM and high-current Xe plasma FIB for fast, clean, and artifact-free results across materials and semiconductor workflows

AMBER X 2

TENSOR
Analytical 4D-STEM for Everyone
TESCAN's 4D-STEM, redefining nanoscale multimodal characterization with synchronized diffraction imaging, EDS acquisition, beam blanking, and real-time data processing. TENSOR is as easy to use as an SEM — bringing true structural, morphological, and chemical analysis within reach of all researchers.
TESCAN TENSOR
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UniTOM HR
Real-Time Submicron 3D Imaging
The first dynamic micro-CT with true submicron resolution for non-destructive 3D imaging. See it in action and discover how UniTOM HR captures fine structural detail and supports advanced, in-situ materials characterization. A new standard in high-resolution, real-time micro-CT.
TESCAN UniTOM HR

NanoSpace VR Experience
Configure the TESCAN UHV FIBs-SEM-SIMS in Virtual Reality
Experience the latest VR demonstration of NanoSpace. Put on the goggles and design your ideal UHV FIB-SEM. In this interactive VR station, you can explore the NanoSpace platform.
NANOSPACE by Orsay Physics
Workshop

Proven to Lead: Automated FIB-SEM Workflows
When automation meets versatility. Learn how TESCAN’s automation simplifies FIB-SEM operations for new users, boosts lab productivity, and unlocks new application possibilities. Discover how unattended workflows, large-area analysis, and nanoscale prep all come together to elevate throughput.

Micro CT
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Workshop

Boosting Productivity with Multimodal STEM
Analytical 4D-STEM for real labs. This session shows how TENSOR simplifies advanced STEM techniques — including 4D-STEM and 3D-ED — through fully integrated automation and intuitive data workflows. From defect analysis in alloys to beam-sensitive materials, see how you can achieve more in a single session.

Micro CT
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Poster Presentation

Unraveling metal hydride phase transformation mechanisms of Magnesium thin films using in situ/ex situ STEM EELS
The poster investigates how hydrogenation and dehydrogenation mechanisms in magnesium thin films are influenced by temperature, hydrogen pressure, and grain orientation, using in-situ and ex-situ STEM and EELS techniques. The study reveals distinct phase transformation behaviors under identical conditions, highlighting asymmetry in hydrogen storage kinetics.

Micro CT
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Poster Presentation

Employing Xe Plasma FIB for Fast and Precise Sample Preparation.

Micro CT
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Poster Presentation

Influence of Applied Ion Energy on Low-Damage (S)TEM Sample Preparation Using Different Ion Species
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Micro CT
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Poster Presentation

Application of Photogrammetry in SEM for High-Resolution 3D Reconstruction of Regions of Interest

Micro CT
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Discover the latest FIB-SEM feature upgrades and innovations



Dr. Yongkai Zhou had working experience with top 5 world EM producers and GlobalFoundries, taking various roles doing Electron Microscopy related businesses. He has vast experience in TEM, FIB, SEM, and MicroCT applications for materials science research and semiconductor failure analysis.

Jérémie Silvent is the Sales Manager for Orsay Physics and Product Sales Leader for all the Orsay Physics products, including subsystems and OEM business. He is working for TESCAN Group since 2016. Before, Jérémie did multiple post-doctorate research projects where he specialized in cryo-SEM and cryo-FIB SEM.

Enthusiastic and experienced product and marketing manager of TEM/STEM microscopes with over 4-years of experience managing mid-range TEM products from market analysis to product conception, development and release.

Product marketing manager for FIB-SEM 3D characterization and TEM lamela preparation in Materials science with over 8 years experienceworking with FIB-SEM instruments.

Lucie (Customer Solutions Specialist) brings rich customer service experience, mainly from the area of logistics and planning. Her main responsibility is service-product management.

Dirk van der Wal is acting Chief Marketing Officer, and Liaison Officer for TESCAN White Label partners in Japan and China. His experience includes applications, product management and product marketing of charged particle optics instruments (SEM, STEM, FIB and micro-CT), primarily in the fields of Materials Science incl. Batteries, Geosciences, and Process Mineralogy (Automated Mineralogy).
OptiGIS O₂
Smarter milling for carbon-based materials
Inject oxygen during patterning to boost etch rates up to 50%, reduce carbon redeposition, and improve contrast in polymers, resins, and diamond substrates.
TEM AutoPrep Pro
High-quality lamellas
Fully automated inverted and planar lift-out workflows and robust failure-handling. Even novice users can prepare thin TEM samples with confidence.
AutoSection
Cross-sectioning on autopilot
Automate cross-sectioning across multiple areas and samples with enhanced surface quality and higher throughput. AutoSection combines rocking polish automation, intelligent image-based navigation, and overnight batch scheduling to maximize your lab’s productivity and reproducibility.